Flex PCB Fabrication Capabilities 

Flexible Printed Interconnect Solutions (FPC)is becoming increasingly importantdue to flexibility, space and weight savings. FPC offers benefits whichenable engineers to solve various design issues, including:

  • Bending flexibility
  • Bending cycle tolerance
  • Space and weight savings
  • Anti-vibration resistant

SHAX Engineering offers high-precision and high repeatability solutions that cover a wide range of flexible printed interconnect design choices. They include custom material, varying surface finishes and single and multilayer constructions that meet the following manufacturing specifications:

PC Board Attributes

Max Board Size 22”x16”
Flex Materials DuPont Pyralux AC, AP, FR and LF
Material type Polyimide
Trace/Space .004”/.004”
Total Thickness 1-layer 0,13mm +/-10%
Total Thickness 2-layers 0,15mm to 0,20mm
Number of Layers 1 to 2 layers
Copper thickness 1-layer 35µm
Copper thickness 2-layers 35µm
Copper Weight ¼ oz to 3 oz
Core Thickness .001” to .007”
Hole Sizes .002” to .250”
Through hole plating (THP) Yes
Board Thickness .002” to .125”
Solder mask oder cover lay Yes
Surface Finish ENIG, HAL, silver, OSP
Surface Finish Immersion Gold
Smallest structures 6mil
Electrical test Yes
Silk Print Top Silk print top
Stiffeners FR4 0,20mm optional
Smallest Finished Hole Size (plated) 0,25mm
Compliance IPC-6013

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