Layout Check list 

Basic Requirements

  • Schematics shall be completed and free of errors. The NETLIST shall be reviewed and free of errors.
  • Provide the NETLIST or the schematic in ORCAD.
  • Specify any special design rules or restrictions.
  • Provide a soft or hardcopy or a URL of all design parts data sheets.
  • Specify trace width and stack up preference.

Schematics

  • All parts shall be shown and clearly identified on schematic.
  • Parts shall be labeled with reference designators.
  • Pins shall be identified and numbered.
  • Grounds shall be identified and clearly separated.
  • Powers shall be identified and clearly separated.
  • Polarized Capacitors shall be identified and marked with + sign.
  • Special traces for high current or high frequency or differential traces shall be identified and marked.

Bill of Material

  • List reference designator, manufacturer and part number.
  • Identify and define the package style.

Mechanical

  • Define board dimensions, thickness and mounting holes sizes and locations.
  • Define the restricted areas where no components or traces are allowed.
  • Define critical parts’ locations such as interface connectors and jacks.
  • Define mounting holes, power, RF and other interface connectors.
  • Show critical component heights or any heat sink requirements.
  • Specify if panelization is required.

Placement/Routing Instructions

  • Provide floor plan or sketch for the placement plan.
  • Locate critical parts that are close to each other.
  • Define power supply best location on the board.
  • Special traces for high current or high frequency or differential traces shall be identified and marked. High speed traces are traces carried 600 MHZ or above.
  • Identify and define power conductor width for power and ground signals.
  • Identify and define the trace width, spacing and the value for impedance control signals.
  • If possible, define layers stack-up.
  • Identify all differential pair traces and matched length.
  • Define routing technology, trace width and spacing.
  • Does any signal requires ground shielding?
  • Is the board going to be ICT tested? What are the test points required?

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